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Trade Shows
          Exhibition for Electronic Component/Manufacturing & Fiber Optics Communication


Industry Field: Electronic Component/Manufacturing & Fiber Optics Communications
Publication: InterNepcon World Japan
Website: www.nepconworld.jp
Publisher: Reed Exhibitions Japan
Rep Company: Adept Marketing
Frequency: January per year
Circulation: Tokyo, Japan
Exhibitors: Over 1,000 companies


InterNepcon Japan
Featuring all kinds of materials, equipment and technologies for electronics manufacturing and SMT

Electrotest Japan
Featuring all kinds of test, inspection and measurement systemsfor SMT, IC Packaging and board manufacturing.

IC Packaging Technology Expo(ICP)
Specialised in IC final manufacturing (Assembly, Test & packaging)

Printed Wiring Boards Expo(PWB EXPO)
Featuring all kinds of Printed Wiring Boards, Modular Boards, EMS,up to CAD tools.

Intl Electronic Components Trade Show(ELE TRADE)
Specialised in conducting business discussions for custom-made,technical consultation and components procurement of all kinds of electronic components and devices.

Fiber Optics Expo (FOE)
Specialised in optical fiber communication.

Concurrent Events

- InterNepcon Japan/Electrotest Japan Technical Conference
- IC Packaging Technology Expo Technical Conference
- Printed Wiring Boards Expo Technical Conference
- Fiber Optics Expo Technical Conference


Raw Space C JPY435,000/booth (3.0m x 2.7m)
Corner Charge C JPY15,000/corner (additional)
Rental Display System


(At additional cost. Not included in the space.)


- Type A: JPY250,000/booth
- Type B: JPY170,000/booth

Adept Marketing - All Rights Reserved.